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Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications Author James J. Licari
ISBN-10 1437778909
Release 2011-06-24
Pages 512
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Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel



Advanced Adhesives in Electronics

Advanced Adhesives in Electronics Author M O Alam
ISBN-10 9780857092892
Release 2011-05-25
Pages 280
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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques



Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications Author Jiawei Zhang
ISBN-10 0128119780
Release 2018-05
Pages 550
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them



Handbook of Polymer Coatings for Electronics

Handbook of Polymer Coatings for Electronics Author James J. Licari
ISBN-10 9780815517689
Release 1990-12-31
Pages 408
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This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.



Coating Materials for Electronic Applications

Coating Materials for Electronic Applications Author James J. Licari
ISBN-10 9780815516477
Release 2003-06-11
Pages 545
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This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.



Electronics Manufacturing

Electronics Manufacturing Author John H. Lau
ISBN-10 9780071500876
Release 2002-09-13
Pages 700
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ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives



Materials for Advanced Packaging

Materials for Advanced Packaging Author Daniel Lu
ISBN-10 9783319450988
Release 2016-11-18
Pages 969
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.



Hybrid Microcircuit Technology Handbook 2nd Edition

Hybrid Microcircuit Technology Handbook  2nd Edition Author James J. Licari
ISBN-10 9780815517986
Release 1998-12-31
Pages 600
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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.



Technology Development and Marketing

Technology Development and Marketing Author Junmo Kim
ISBN-10 9781546245766
Release 2018-06-07
Pages 128
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Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.



Wireless Medical Systems and Algorithms

Wireless Medical Systems and Algorithms Author Pietro Salvo
ISBN-10 9781351830232
Release 2017-11-22
Pages 284
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Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical systems, from biochips to brain–computer interfaces and beyond. The book also examines some of the most advanced algorithms and data processing in the field. Addressing the latest challenges and solutions related to the medical needs, electronic design, advanced materials chemistry, wireless body sensor networks, and technologies suitable for wireless medical devices, the text: Investigates the technological and manufacturing issues associated with the development of wireless medical devices Introduces the techniques and strategies that can optimize the performances of algorithms for medical applications and provide robust results in terms of data reliability Includes a variety of practical examples and case studies relevant to engineers, medical doctors, chemists, and biologists Wireless Medical Systems and Algorithms: Design and Applications not only highlights new technologies for the continuous surveillance of patient health conditions, but also shows how disciplines such as chemistry, biology, engineering, and medicine are merging to produce a new class of smart devices capable of managing and monitoring a wide range of cognitive and physical disabilities.



Adhesives Technology Handbook

Adhesives Technology Handbook Author Sina Ebnesajjad
ISBN-10 9780323356022
Release 2014-11-26
Pages 432
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Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion



Surface Treatment of Materials for Adhesive Bonding

Surface Treatment of Materials for Adhesive Bonding Author Sina Ebnesajjad
ISBN-10 9780323265041
Release 2013-10-22
Pages 360
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Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surface science and surface treatments technologies to enable practitioners to improve existing surface preparation processes to improve adhesion and, as a result, enhance product life. This book describes and illustrates the surface preparations and operations that must be applied to a surface before acceptable adhesive bonding is achieved. It is meant to be an exhaustive overview, including more detailed explanation where necessary, in a continuous and logical progression. The book provides a necessary grounding in the science and practice of adhesion, without which adequate surface preparation is impossible. Surface characterization techniques are included, as is an up-to-date assessment of existing surface treatment technologies such as Atmospheric Plasma, Degreasing, Grit blasting, laser ablation and more. Fundamental material considerations are prioritised over specific applications, making this book relevant to all industries using adhesives, such as medical, automotive, aerospace, packaging and electronics. This second edition represents a full and detailed update, with all major developments in the field included and three chapters added to cover ceramic surface treatment, plasma treatment of non-metallic materials, and the effect of additives on surface properties of plastics. A vital resource for improving existing surface treatment processes to increase product life by creating stronger, more durable adhesive bonds Relevant across a variety of industries, including medical, automotive and packaging Provides essential grounding in the science of surface adhesion, and details how this links with the practice of surface treatment



Handbook of Adhesives and Surface Preparation

Handbook of Adhesives and Surface Preparation Author Sina Ebnesajjad
ISBN-10 1437744621
Release 2010-12-15
Pages 450
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Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard‐working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. A handbook that truly focuses on the applied aspects of adhesives selection and applications: this is a book that won't gather dust on the shelf Provides practical techniques for rendering materials surfaces adherable Sector‐based studies explore the specific issues for automotive and aerospace, medical, dental and electronics



Surface Preparation Techniques for Adhesive Bonding

Surface Preparation Techniques for Adhesive Bonding Author Raymond F. Wegman
ISBN-10 9781455731282
Release 2012-12-31
Pages 168
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Surface Preparation Techniques for Adhesive Bonding is an essential guide for materials scientists, mechanical engineers, plastics engineers, scientists and researchers in manufacturing environments making use of adhesives technology. Wegman and van Twisk provide practical coverage of a topic that receives only cursory treatment in more general books on adhesives, making this book essential reading for adhesion specialists, plastics engineers, and a wide range of engineers and scientists working in sectors where adhesion is an important technology, e.g. automotive / aerospace, medical devices, electronics. Wegman and van Twisk provide a wealth of practical information on the processing of substrate surfaces prior to adhesive bonding. The processing of aluminum and its alloys, titanium and its alloys, steels, copper and its alloys, and magnesium are treated in the form of detailed specifications with comparative data. Other metals not requiring extensive treatment are also covered in detail, as are metal matrix and organic matrix composites, thermosets and thermoplastics. This new edition has been updated with coverage of the latest developments in the field including the sol-gel process for aluminum, titanium, and stainless steel, atmospheric plasma treatment for metals, plastics and rubbers and treatments for bronze and nickel alloys. Updated to include recent technological developments and chemicals currently prescribed for cleaning and surface preparation; a new generation of adhesives technologists can benefit from this classic guide Enables Materials and Process personnel to select the best process available for their particular application Practical coverage of a topic that receives only cursory coverage in more general books on adhesives: essential reading for adhesion specialists, plastics engineers, and a wide range of engineers and scientists working in sectors where adhesion is an important technology, e.g. automotive / aerospace, medical devices, electronics



Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging

Advanced Manufacturing Process  Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging Author Christopher Bailey
ISBN-10 9781846630101
Release 2006
Pages 72
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Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging has been writing in one form or another for most of life. You can find so many inspiration from Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging book for free.



Comprehensive Materials Processing

Comprehensive Materials Processing Author
ISBN-10 9780080965338
Release 2014-04-07
Pages 5634
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Comprehensive Materials Processing provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources



Packaging Technology

Packaging Technology Author Anne Emblem
ISBN-10 9780857095701
Release 2012-10-29
Pages 600
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Packaging is a complex and wide-ranging subject. Comprehensive in scope and authoritative in its coverage, Packaging technology provides the ideal introduction and reference for both students and experienced packaging professionals. Part one provides a context for the book, discussing fundamental issues relating to packaging such as its role in society and its diverse functions, the packaging supply chain and legislative, environmental and marketing issues. Part two reviews the principal packaging materials such as glass, metal, plastics, paper and paper board. It also discusses closures, adhesives and labels. The final part of the book discusses packaging processes, from design and printing to packaging machinery and line operations, as well as hazard and risk management in packaging. With its distinguished editors and expert contributors, Packaging technology is a standard text for the packaging industry. The book is designed both to meet the needs of those studying for the Diploma in Packaging Technology and to act as a comprehensive reference for packaging professionals. Provides the ideal introduction and reference for both students and experienced packaging professionals Examines fundamental issues relating to packaging, such as its role in society, its diverse functions, the packaging supply chain and legislative, environmental and marketing issues Reviews the principal packaging materials such as glass, metal, plastics, paper and paper board