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Heat Transfer

Heat Transfer Author Younes Shabany
ISBN-10 9781439814680
Release 2009-12-17
Pages 523
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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.



Heat Transfer

Heat Transfer Author Younes Shabany
ISBN-10 1439814678
Release 2009-12-17
Pages 523
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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.



Advanced Thermal Design of Electronic Equipment

Advanced Thermal Design of Electronic Equipment Author Ralph Remsburg
ISBN-10 9781441985095
Release 2011-06-27
Pages 589
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The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.



Thermal Management Handbook For Electronic Assemblies

Thermal Management Handbook  For Electronic Assemblies Author Jerry Sergent
ISBN-10 0070266999
Release 1998
Pages 650
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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.



Thermal Measurements in Electronics Cooling

Thermal Measurements in Electronics Cooling Author Kaveh Azar
ISBN-10 0849332796
Release 1997-08-11
Pages 496
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Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.



Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging Author Xingcun Colin Tong Ph.D
ISBN-10 1441977597
Release 2011-01-05
Pages 618
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.



Thermal Management of Microelectronic Equipment

Thermal Management of Microelectronic Equipment Author Lian-Tuu Yeh
ISBN-10 0791861090
Release 2016-04
Pages 524
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This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.



Thermal Management of Electronic Systems

Thermal Management of Electronic Systems Author C.J. Hoogendoorn
ISBN-10 9789401110822
Release 2012-12-06
Pages 335
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The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.



Qpedia Thermal Management Electronics Cooling Book Volume 3

Qpedia Thermal Management     Electronics Cooling Book  Volume 3 Author Advanced Thermal Solutions
ISBN-10 9780984627912
Release 2009-01-01
Pages
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The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.



Cooling of Electronic Systems

Cooling of Electronic Systems Author Sadik Kakaç
ISBN-10 9789401110907
Release 2012-12-06
Pages 962
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Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.



Cooling of Electronic Systems

Cooling of Electronic Systems Author Sadik Kakaç
ISBN-10 0792327365
Release 1994-02-28
Pages 962
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Proceedings of the NATO Advanced Study Institute, Çesme/Izmir, Turkey, June 21--July 2, 1993



Thermal Computations for Electronics

Thermal Computations for Electronics Author Gordon Ellison
ISBN-10 9781439891261
Release 2010-11-08
Pages 416
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A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.



Thermal Design

Thermal Design Author H. S. Lee
ISBN-10 1118004701
Release 2010-11-17
Pages 648
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The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided.



Qpedia Thermal Management Electronics Cooling Book Volume 1

Qpedia Thermal Management     Electronics Cooling Book  Volume 1 Author
ISBN-10 9780615236605
Release
Pages
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Qpedia Thermal Management Electronics Cooling Book Volume 1 has been writing in one form or another for most of life. You can find so many inspiration from Qpedia Thermal Management Electronics Cooling Book Volume 1 also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Qpedia Thermal Management Electronics Cooling Book Volume 1 book for free.



Practical Guide to the Packaging of Electronics Second Edition

Practical Guide to the Packaging of Electronics  Second Edition Author Ali Jamnia
ISBN-10 9781439870921
Release 2008-11-20
Pages 320
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As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.



Thermal Design of Electronic Equipment

Thermal Design of Electronic Equipment Author Ralph Remsburg
ISBN-10 9781351835916
Release 2017-12-21
Pages 400
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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.



Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures

Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures Author Albert Greve
ISBN-10 3642038670
Release 2010-03-17
Pages 420
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Radio telescopes as well as communication antennas operate under the influence of gravity, temperature and wind. Among those, temperature influences may degrade the performance of a radio telescope through transient changes of the focus, pointing, path length and sensitivity, often in an unpredictable way. Thermal Design and Thermal Behaviour of Radio Telescopes and their Enclosures reviews the design and construction principles of radio telescopes in view of thermal aspects and heat transfer with the variable thermal environment; it explains supporting thermal model calculations and the application and efficiency of thermal protection and temperature control; it presents many measurements illustrating the thermal behaviour of telescopes in the environment of their observatory sites. The book benefits scientists and radio/communication engineers, telescope designers and construction firms as well as telescope operators, observatory staff, but also the observing astronomer who is directly confronted with the thermal behaviour of a telescope.