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MEMS and Microstructures in Aerospace Applications

MEMS and Microstructures in Aerospace Applications Author Robert Osiander
ISBN-10 9781420027747
Release 2005-10-06
Pages 400
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The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.

Mems for Automotive and Aerospace Applications

Mems for Automotive and Aerospace Applications Author Michael Kraft
ISBN-10 9780857096487
Release 2013-01-02
Pages 360
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MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries. Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation. With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace

Handbook of Space Engineering Archaeology and Heritage

Handbook of Space Engineering  Archaeology  and Heritage Author Ann Darrin
ISBN-10 1420084321
Release 2009-06-26
Pages 1035
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Some might think that the 27 thousand tons of material launched by earthlings into outer space is nothing more than floating piles of debris. However, when looking at these artifacts through the eyes of historians and anthropologists, instead of celestial pollution, they are seen as links to human history and heritage. Space: The New Frontier for Archeologists Handbook of Space Engineering, Archaeology and Heritage, published this month by CRC Press Taylor and Francis Group, brings together 43 anthropologists, historians, physicists, and engineers, a scientific team as culturally diverse as the crew of any science fiction cruiser. They offer a range of novel historical and technological perspectives on humankind’s experience in space. This ambitious work presents an informative, thought-provoking, and educational text that discusses the evolution of space engineering, spacecraft reliability and forensics, field techniques, and mission planning, as well as space programs for the future. The book is edited by a pair of scientists from different sides of the campus: Ann Garrison Darrin, aerospace engineer and NASA veteran and Beth Laura O’Leary, anthropologist and member of the World Archaeological Congress Space Heritage Task Force. The handbook delves into the evolution of space archaeology and heritage, including the emerging fields of Archaeoastronomy, Ethnoastronomy, and Cultural Astronomy. It also covers space basics and the history of the space age from Sputnik to modern day satellites. It discusses the cultural landscape of space, including orbital artifacts in space, as well as objects left on planetary surfaces and includes a look at the culture of Apollo as a catalog of manned exploration of the moon. It also considers the application of forensic investigation to the solving of cold case mysteries including failed Mars mission landing sites and lost spacecraft, and even investigates the archaeology of the putative Roswell UFO crash site and appraises material culture in science fiction.

Ceramic Thick Films for MEMS and Microdevices

Ceramic Thick Films for MEMS and Microdevices Author Robert A. Dorey
ISBN-10 9781437778175
Release 2011
Pages 191
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The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc. Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups. Written by a single author, this book provides a clear, coherently-written guide to this important emerging technology. Covers materials, fabrication and applications in one book.

MEMS and Nanotechnology Based Sensors and Devices for Communications Medical and Aerospace Applications

MEMS and Nanotechnology Based Sensors and Devices for Communications  Medical and Aerospace Applications Author A. R. Jha
ISBN-10 9780203881064
Release 2008-04-08
Pages 432
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The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applications. MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applications presents the latest performance parameters and experimental data of state-of-the-art sensors and devices. It describes packaging details, materials and their properties, and fabrication requirements vital for design, development, and testing. Some of the cutting-edge materials covered include quantum dots, nanoparticles, photonic crystals, and carbon nanotubes (CNTs). This comprehensive work encompasses various types of MEMS- and NT-based sensors and devices, such as micropumps, accelerometers, photonic bandgap devices, acoustic sensors, CNT-based transistors, photovoltaic cells, and smart sensors. It also discusses how these sensors and devices are used in a number of applications, including weapons’ health, battlefield monitoring, cancer research, stealth technology, chemical detection, and drug delivery.

Microengineering Aerospace Systems

Microengineering Aerospace Systems Author Henry Helvajian
ISBN-10 1884989039
Release 1999-01-01
Pages 707
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Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples.

Mems Packaging

Mems Packaging Author Lee Yung-cheng
ISBN-10 9789813229372
Release 2018-01-03
Pages 364
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MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics

MEMS Components and Applications for Industry Automobiles Aerospace and Communication

MEMS Components and Applications for Industry  Automobiles  Aerospace  and Communication Author Henry Helvajian
ISBN-10 UOM:39015053518612
Release 2001
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MEMS Components and Applications for Industry Automobiles Aerospace and Communication has been writing in one form or another for most of life. You can find so many inspiration from MEMS Components and Applications for Industry Automobiles Aerospace and Communication also informative, and entertaining. Click DOWNLOAD or Read Online button to get full MEMS Components and Applications for Industry Automobiles Aerospace and Communication book for free.

Satellite Thermal Control for Systems Engineers

Satellite Thermal Control for Systems Engineers Author Robert D. Karam
ISBN-10 1600864333
Release 1998
Pages 274
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Satellite Thermal Control for Systems Engineers has been writing in one form or another for most of life. You can find so many inspiration from Satellite Thermal Control for Systems Engineers also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Satellite Thermal Control for Systems Engineers book for free.

MEMS Linear and Nonlinear Statics and Dynamics

MEMS Linear and Nonlinear Statics and Dynamics Author Mohammad I. Younis
ISBN-10 1441960201
Release 2011-06-27
Pages 456
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MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of numerous MEMS devices and structures that require static or dynamic modeling Provides code for programs in Matlab, Mathematica, and ANSYS for simulating the behavior of MEMS structures Provides real world problems related to the dynamics of MEMS such as dynamics of electrostatically actuated devices, stiction and adhesion of microbeams due to electrostatic and capillary forces MEMS Linear and Nonlinear Statics and Dynamics is an ideal volume for researchers and engineers working in MEMS design and fabrication.


MEMS and NEMS Author Sergey Edward Lyshevski
ISBN-10 9781420040517
Release 2002-01-18
Pages 461
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The development of micro- and nano-mechanical systems (MEMS and NEMS) foreshadows momentous changes not only in the technological world, but in virtually every aspect of human life. The future of the field is bright with opportunities, but also riddled with challenges, ranging from further theoretical development through advances in fabrication technologies, to developing high-performance nano- and microscale systems, devices, and structures, including transducers, switches, logic gates, actuators and sensors. MEMS and NEMS: Systems, Devices, and Structures is designed to help you meet those challenges and solve fundamental, experimental, and applied problems. Written from a multi-disciplinary perspective, this book forms the basis for the synthesis, modeling, analysis, simulation, control, prototyping, and fabrication of MEMS and NEMS. The author brings together the various paradigms, methods, and technologies associated with MEMS and NEMS to show how to synthesize, analyze, design, and fabricate them. Focusing on the basics, he illustrates the development of NEMS and MEMS architectures, physical representations, structural synthesis, and optimization. The applications of MEMS and NEMS in areas such as biotechnology, medicine, avionics, transportation, and defense are virtually limitless. This book helps prepare you to take advantage of their inherent opportunities and effectively solve problems related to their configurations, systems integration, and control.

Introduction to Microelectromechanical Systems Engineering

Introduction to Microelectromechanical Systems Engineering Author Nadim Maluf
ISBN-10 1580535917
Release 2004
Pages 283
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Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.

Advanced RF MEMS

Advanced RF MEMS Author Stepan Lucyszyn
ISBN-10 9781139491662
Release 2010-08-19
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An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation

VLSI Circuits and Systems

VLSI Circuits and Systems Author José Fco López
ISBN-10 UOM:39015052651588
Release 2003
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VLSI Circuits and Systems has been writing in one form or another for most of life. You can find so many inspiration from VLSI Circuits and Systems also informative, and entertaining. Click DOWNLOAD or Read Online button to get full VLSI Circuits and Systems book for free.

The MEMS Handbook

The MEMS Handbook Author Mohamed Gad-el-Hak
ISBN-10 1420050907
Release 2001-09-27
Pages 1368
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The revolution is well underway. Our understanding and utilization of microelectromechanical systems (MEMS) are growing at an explosive rate with a worldwide market approaching billions of dollars. In time, microdevices will fill the niches of our lives as pervasively as electronics do right now. But if these miniature devices are to fulfill their mammoth potential, today's engineers need a thorough grounding in the underlying physics, modeling techniques, fabrication methods, and materials of MEMS. The MEMS Handbook delivers all of this and more. Its team of authors-unsurpassed in their experience and standing in the scientific community- explore various aspects of MEMS: their design, fabrication, and applications as well as the physical modeling of their operations. Designed for maximum readability without compromising rigor, it provides a current and essential overview of this fledgling discipline.

Microfabrication and Precision Engineering

Microfabrication and Precision Engineering Author J Paulo Davim
ISBN-10 9780857094865
Release 2017-01-15
Pages 286
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Microfabrication and precision engineering is an increasingly important area relating to metallic, polymers, ceramics, composites, biomaterials and complex materials. Micro-electro-mechanical-systems (MEMS) emphasize miniaturization in both electronic and mechanical components. Microsystem products may be classified by application, and have been applied to a variety of fields, including medical, automotive, aerospace and alternative energy. Microsystems technology refers to the products as well as the fabrication technologies used in production. With detailed information on modelling of micro and nano-scale cutting, as well as innovative machining strategies involved in microelectrochemical applications, microchannel fabrication, as well as underwater pulsed Laser beam cutting, among other techniques, Microfabrication and Precision Engineering is a valuable reference for students, researchers and professionals in the microfabrication and precision engineering fields. Contains contributions by top industry experts Includes the latest techniques and strategies Special emphasis given to state-of-the art research and development in microfabrication and precision engineering

Flight Mechanics Modeling and Analysis

Flight Mechanics Modeling and Analysis Author Jitendra R. Raol
ISBN-10 9781420067552
Release 2008-08-20
Pages 440
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The design, development, analysis, and evaluation of new aircraft technologies such as fly by wire, unmanned aerial vehicles, and micro air vehicles, necessitate a better understanding of flight mechanics on the part of the aircraft-systems analyst. A text that provides unified coverage of aircraft flight mechanics and systems concept will go a long way to making analysis of these new technologies quicker and easier.