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Solder Joint Reliability Assessment

Solder Joint Reliability Assessment Author Mohd N. Tamin
ISBN-10 9783319000923
Release 2014-04-26
Pages 174
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This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.



Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments Author Andrew E. Perkins
ISBN-10 9780387793948
Release 2008-12-16
Pages 192
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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.



Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging

Advanced Manufacturing Process  Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging Author Christopher Bailey
ISBN-10 9781846630101
Release 2006
Pages 72
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Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging has been writing in one form or another for most of life. You can find so many inspiration from Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging book for free.



Computational Mechanics Abstract

Computational Mechanics Abstract Author Zhenhan Yao
ISBN-10 7302093415
Release 2004
Pages 554
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Computational Mechanics Abstract has been writing in one form or another for most of life. You can find so many inspiration from Computational Mechanics Abstract also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Computational Mechanics Abstract book for free.



Handbook of Research on Advanced Computational Techniques for Simulation Based Engineering

Handbook of Research on Advanced Computational Techniques for Simulation Based Engineering Author Samui, Pijush
ISBN-10 9781466694804
Release 2015-11-30
Pages 617
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Recent developments in information processing systems have driven the advancement of computational methods in the engineering realm. New models and simulations enable better solutions for problem-solving and overall process improvement. The Handbook of Research on Advanced Computational Techniques for Simulation-Based Engineering is an authoritative reference work representing the latest scholarly research on the application of computational models to improve the quality of engineering design. Featuring extensive coverage on a range of topics from various engineering disciplines, including, but not limited to, soft computing methods, comparative studies, and hybrid approaches, this book is a comprehensive reference source for students, professional engineers, and researchers interested in the application of computational methods for engineering design.



Electronic and photonics packaging 2006

Electronic and photonics packaging 2006 Author American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
ISBN-10 0791847691
Release 2007-07
Pages 526
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Electronic and photonics packaging 2006 has been writing in one form or another for most of life. You can find so many inspiration from Electronic and photonics packaging 2006 also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Electronic and photonics packaging 2006 book for free.



Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly Author Sheng Liu
ISBN-10 9780470828410
Release 2011-08-24
Pages 288
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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging



Metals Abstracts

Metals Abstracts Author
ISBN-10 CORNELL:31924077935595
Release 1998
Pages
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Metals Abstracts has been writing in one form or another for most of life. You can find so many inspiration from Metals Abstracts also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Metals Abstracts book for free.



Solder Joint Technology

Solder Joint Technology Author King-Ning Tu
ISBN-10 9780387388922
Release 2007-07-27
Pages 370
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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.



Electrical Electronics Abstracts

Electrical   Electronics Abstracts Author
ISBN-10 OSU:32435059588608
Release 1997
Pages
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Electrical Electronics Abstracts has been writing in one form or another for most of life. You can find so many inspiration from Electrical Electronics Abstracts also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Electrical Electronics Abstracts book for free.



Thermo mechanical characterization of evolving packaging materials and structures

Thermo mechanical characterization of evolving packaging materials and structures Author American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
ISBN-10 UOM:39015041887764
Release 1998-01
Pages 141
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Thermo mechanical characterization of evolving packaging materials and structures has been writing in one form or another for most of life. You can find so many inspiration from Thermo mechanical characterization of evolving packaging materials and structures also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Thermo mechanical characterization of evolving packaging materials and structures book for free.



Chemical Abstracts

Chemical Abstracts Author
ISBN-10 UOM:39015057323886
Release 2002
Pages
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Chemical Abstracts has been writing in one form or another for most of life. You can find so many inspiration from Chemical Abstracts also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Chemical Abstracts book for free.



Scientific and Technical Aerospace Reports

Scientific and Technical Aerospace Reports Author
ISBN-10 COLUMBIA:CU10204369
Release 1995
Pages
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Scientific and Technical Aerospace Reports has been writing in one form or another for most of life. You can find so many inspiration from Scientific and Technical Aerospace Reports also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Scientific and Technical Aerospace Reports book for free.



Design Reliability of Solders and Solder Interconnections

Design   Reliability of Solders and Solder Interconnections Author Rao K. Mahidhara
ISBN-10 UVA:X004140055
Release 1997
Pages 448
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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.



Application of fracture mechanics in electronic packaging

Application of fracture mechanics in electronic packaging Author William T. Chen
ISBN-10 UOM:39015041737084
Release 1997-01
Pages 193
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Application of fracture mechanics in electronic packaging has been writing in one form or another for most of life. You can find so many inspiration from Application of fracture mechanics in electronic packaging also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Application of fracture mechanics in electronic packaging book for free.



Prognostics and Health Management of Electronics

Prognostics and Health Management of Electronics Author Michael G. Pecht
ISBN-10 9781119515302
Release 2018-08-15
Pages 800
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An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.



Applications of Chalcogenides S Se and Te

Applications of Chalcogenides  S  Se  and Te Author Gurinder Kaur Ahluwalia
ISBN-10 9783319411903
Release 2016-11-02
Pages 461
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This book introduces readers to a wide range of applications for elements in Group 16 of the periodic table, such as, optical fibers for communication and sensing, X-ray imaging, electrochemical sensors, data storage devices, biomedical applications, photovoltaics and IR detectors, the rationale for these uses, the future scope of their applications, and expected improvements to existing technologies. Following an introductory section, the book is broadly divided into three parts—dealing with Sulfur, Selenium, and Tellurium. The sections cover the basic structure of the elements and their compounds in bulk and nanostructured forms; properties that make these useful for various applications, followed by applications and commercial products. As the global technology revolution necessitates the search for new materials and more efficient devices in the electronics and semiconductor industry, Applications of Chalcogenides: S, Se, and Te is an ideal book for a wide range of readers in industry, government and academic research facilities looking beyond silicon for materials used in the electronic and optoelectronic industry as well as biomedical applications.