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VLSI Metallization

VLSI Metallization Author Norman G. Einspruch
ISBN-10 9781483217819
Release 2014-12-01
Pages 490
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VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.



Reduced Thermal Processing for ULSI

Reduced Thermal Processing for ULSI Author R.A. Levy
ISBN-10 9781461305415
Release 2012-12-06
Pages 450
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As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.



VLSI metallization

VLSI metallization Author Norman G. Einspruch
ISBN-10 UCSD:31822003040912
Release 1987-08
Pages 480
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VLSI metallization has been writing in one form or another for most of life. You can find so many inspiration from VLSI metallization also informative, and entertaining. Click DOWNLOAD or Read Online button to get full VLSI metallization book for free.



VLSI Electronics Microstructure Science

VLSI Electronics Microstructure Science Author Norman G. Einspruch
ISBN-10 9781483217741
Release 2014-12-01
Pages 414
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VLSI Electronics: Microstructure Science, Volume 7 presents a comprehensive exposition and assessment of the developments and trends in VLSI (Very Large Scale Integration) electronics. This treatise covers subjects that range from microscopic aspects of materials behavior and device performance to the comprehension of VLSI in systems applications. Each chapter is prepared by a recognized authority. The topics contained in this volume include a basic introduction to the application of superconductivity in high-speed digital systems; the expected impact of VLSI technology on the implementation of AI (artificial intelligence); the limits to improvement of silicon integrated circuits; and the various spontaneous noise sources in VLSI circuits and their effect on circuit operation. Scientists, engineers, researchers, device designers, and systems architects will find the book very useful.



Solid State Physics

Solid State Physics Author R. Mukhopadhyay
ISBN-10 8173711984
Release 1999
Pages 548
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Solid State Physics has been writing in one form or another for most of life. You can find so many inspiration from Solid State Physics also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Solid State Physics book for free.



VLSI electronics

VLSI electronics Author Norman G. Einspruch
ISBN-10 UOM:39015016028394
Release 1982
Pages 453
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VLSI electronics has been writing in one form or another for most of life. You can find so many inspiration from VLSI electronics also informative, and entertaining. Click DOWNLOAD or Read Online button to get full VLSI electronics book for free.



VLSI Metallization

VLSI Metallization Author Krishna Shenai
ISBN-10 0890065012
Release 1991
Pages 529
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This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.



Metallization

Metallization Author S. P. Murarka
ISBN-10 0750690011
Release 1993-01-01
Pages 250
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This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.



VLSI Handbook

VLSI Handbook Author Norman Einspruch
ISBN-10 9780323141994
Release 2012-12-02
Pages 928
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VLSI Handbook is a reference guide on very large scale integration (VLSI) microelectronics and its aspects such as circuits, fabrication, and systems applications. This handbook readily answers specific questions and presents a systematic compilation of information regarding the VLSI technology. There are a total of 52 chapters in this book and are grouped according to the fields of design, materials and processes, and examples of specific system applications. Some of the chapters under fields of design are design automation for integrated circuits and computer tools for integrated circuit design. For the materials and processes, there are many chapters that discuss this aspect. Some of them are manufacturing process technology for metal-oxide semiconductor (MOS) VLSI; MOS VLSI circuit technology; and facilities for VLSI circuit fabrication. Other concepts and materials discussed in the book are the use of silicon material in different processes of VLSI, nitrides, silicides, metallization, and plasma. This handbook is very useful to students of engineering and physics. Also, researchers (in physics and chemistry of materials and processes), device designers, and system designers can also benefit from this book.



Application Specific Integrated Circuit ASIC Technology

Application Specific Integrated Circuit  ASIC  Technology Author Norman G. Einspruch
ISBN-10 0122341236
Release 1991
Pages 368
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V. 1-5. [without special title] -- v. 6. Materials and process characterization -- v. 7. [without special title] -- v. 8. Plasma processing for VLSI -- v. 9. [without special title] -- v. 10. Surface and interface effects in VLSI -- v. 11. GaAs microelectronics -- v. 12. Silicon materials -- v. 13. Metal-semiconductor contacts and devices -- v. 14. VLSI design -- v. 15. VLSI metallization -- v. 16. Lithography for VLSI -- v. 17. VLSI in medicine -- v. 18. Advanced MOS device physics -- v. 19. Advanced CMOS process technology -- 20. VLSI and computer architecture -- v. 21. Beam processing technologies -- v. 22. VLSI reliability -- v. 23. Application specific integrated circuit (ASIC) technology -- v. 24. Heterostructures and quantum devices.



Scientific and Technical Books and Serials in Print 1989

Scientific and Technical Books and Serials in Print 1989 Author Bowker Editorial Staff
ISBN-10 0835225550
Release 1988
Pages 4665
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Scientific and Technical Books and Serials in Print 1989 has been writing in one form or another for most of life. You can find so many inspiration from Scientific and Technical Books and Serials in Print 1989 also informative, and entertaining. Click DOWNLOAD or Read Online button to get full Scientific and Technical Books and Serials in Print 1989 book for free.



VLSI electronics

VLSI electronics Author Norman G. Einspruch
ISBN-10 0122341015
Release 1981
Pages 340
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VLSI electronics has been writing in one form or another for most of life. You can find so many inspiration from VLSI electronics also informative, and entertaining. Click DOWNLOAD or Read Online button to get full VLSI electronics book for free.



Plasma Processing for VLSI

Plasma Processing for VLSI Author Norman G. Einspruch
ISBN-10 9781483217758
Release 2014-12-01
Pages 544
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VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.



GaAs Microelectronics

GaAs Microelectronics Author Norman G. Einspruch
ISBN-10 9781483217772
Release 2014-12-01
Pages 472
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VLSI Electronics Microstructure Science, Volume 11: GaAs Microelectronics presents the important aspects of GaAs (Gallium Arsenide) IC technology development ranging from materials preparation and IC fabrication to wafer evaluation and chip packaging. The volume is comprised of eleven chapters. Chapter 1 traces the historical development of GaAs technology for high-speed and high-frequency applications. This chapter summarizes the important properties of GaAs that serve to make this material and its related compounds technologically important. Chapter 2 covers GaAs substrate growth, ion implantation and annealing, and materials characterization, technologies that are essential for IC development. Chapters 3-6 describe the various IC technologies that are currently under development. These include microwave and digital MESFET ICs, the most mature technologies, and bipolar and field-effect heterostructure transistor ICs. The high-speed capability of GaAs ICs introduces new problems, on-wafer testing and packaging. These topics are discussed in Chapters 7 and 8. Applications for GaAs ICs are covered in Chapters 9 and 10. The first of these chapters is concerned with high speed computer applications; the second addresses military applications. The book concludes with a chapter on radiation effects in GaAs ICs. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.



Heterostructures and Quantum Devices

Heterostructures and Quantum Devices Author Norman G. Einspruch
ISBN-10 9781483295176
Release 2014-06-28
Pages 452
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Heterostructure and quantum-mechanical devices promise significant improvement in the performance of electronic and optoelectronic integrated circuits (ICs). Though these devices are the subject of a vigorous research effort, the current literature is often either highly technical or narrowly focused. This book presents heterostructure and quantum devices to the nonspecialist, especially electrical engineers working with high-performance semiconductor devices. It focuses on a broad base of technical applications using semiconductor physics theory to develop the next generation of electrical engineering devices. The text covers existing technologies and future possibilities within a common framework of high-performance devices, which will have a more immediate impact on advanced semiconductor physics-particularly quantum effects-and will thus form the basis for longer-term technology development.



Introduction to Microfabrication

Introduction to Microfabrication Author Sami Franssila
ISBN-10 9781119991892
Release 2010-10-29
Pages 534
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This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike. www.wiley.com/go/Franssila_Micro2e



Introduction to Microelectromechanical Systems Engineering

Introduction to Microelectromechanical Systems Engineering Author Nadim Maluf
ISBN-10 1580535917
Release 2004
Pages 283
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Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.